1

Self-forming AlOx layer as Cu diffusion barrier on porous low-k film

Year:
2010
Language:
english
File:
PDF, 532 KB
english, 2010
4

Phosphorous doped Ru film for advanced Cu diffusion barriers

Year:
2008
Language:
english
File:
PDF, 563 KB
english, 2008
5

Ru/WCoCN as a seedless Cu barrier system for advanced Cu metallization

Year:
2009
Language:
english
File:
PDF, 531 KB
english, 2009